Dissipation Heat Pipe Structure and Manufacturing Method Thereof

ABSTRACT

This invention discloses a manufacturing method and the structure for a dissipation heat pipe. This dissipation heat pipe includes a hollow closed pipe, a type of fluid and a wick structure. The dissipation heat pipe is often used in conducting the heat from a chip. The dissipation heat pipe can be made of a special thermal conduction material, including the metal and a bracket structure of carbon element which have high thermal conductivity, so as to improve the heat conduction efficiency. The corresponding manufacturing method for this heat conduction material can be made by chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can coat on the metal surface and can also be mixed into the metal.

FIELD OF THE INVENTION

The present invention relates to a dissipation heat pipe structure andcorresponding manufacturing method and, more particularly, to themanufacturing method for manufacturing a heat conduction materialcombining a metal with a bracket structure of carbon element.

BACKGROUND OF THE INVENTION

In recent years, the pace of high technology industry development isextremely fast, the development of electronic components is toward smallvolumes and high densities. The efficiency requirements for theaforesaid components also increase that generates much waste heat. Theefficiency of the electronic components will be decreased and destroyedif the waste heat is unable to eliminate appropriately. Therefore,various heat conduction materials are provided to improve the efficiencyof heat dissipation.

In the prior art, the material applying in the heat dissipationstructure usually includes copper or aluminum to be the tendency ofcurrent heat dissipation technology. Traditionally, aluminum applying inthe heat dissipation material is restricted to cause a bottleneckbecause of high temperature conduction is produced by the efficiencyupgrade of central processors. Copper applying in the heat dissipationtechnology is then provided. However, copper has a higher specificgravity that has disadvantage to shape and the application isrestricted. Although both copper and aluminum are used for air coolingto implement heat dissipation, the air cooling incorporating theaforesaid copper and aluminum will be unable to satisfy the demand forheat dissipating when the heat release of chips achieves 50 W/cm².Therefore, the high efficiency of heat dissipation materials needs toimprove.

In addition, to satisfy the demand for the heat dissipation and thespace restriction, a dissipation heat pipe is in widespread use forconducting heat. The dissipation heat pipe can be used in a small andnarrow space by using a fluid within the dissipation heat pipe to absorband release heat to generate a phase change for conducting heat. Agreater heat transfer can be generated by the dissipation heat pipe at aslight temperature difference and there is a reputation of “heatsuperconductor” for the dissipation heat pipe. Therefore, a conventionalheat dissipation module is developed and comprises at least onedissipation heat pipe, at least one heat dissipation slip, and aplurality of heat sink fins.

Referring to FIG. 1, a schematic diagram illustrates a conventional heatdissipation module and a heat conduction process. The heat dissipationmodule as shown in FIG. 1 comprises a heat dissipation slip 11, adissipation heat pipe 12 and a plurality of heat sink fins 13. The heatdissipation slip 11 includes a lower surface 111 and an upper surface112 which is corresponded to the lower surface 111. The heat conductionprocess is that the lower surface 111 of the heat dissipation slip 11 iscontacted to a waste heat generated by a heat source first of all. Thewaste heat is then conducted to the upper surface 112 of the heatdissipation slip 11. The dissipation heat pipe 12 comprises a heatsource end 121 and a heat dissipation end 122. The heat source end 121is coupled to the upper surface 112 of the heat dissipation slip 11. Thewaste heat is conducted to the heat dissipation end 122 of thedissipation heat pipe 12 from the heat source end 121 of the dissipationheat pipe 12. A bottom 131 is formed by the plurality of heat sink fins13. Specifically the bottom 131 is composed of each edge of each fin.The heat dissipation end 122 of the dissipation heat pipe 12 iscontacted to the bottom 131 to conduct the waste heat to the pluralityof heat sink fins 13. Lastly, the waste heat is discharged through theconvection and the radiating.

Besides, diamonds are well known and have characteristics with thehighest hardness, the fastest heat conduction, and the widest refractionrange in current materials. Diamonds, therefore, are always one of moreimportant materials in engineering due to the excellent characteristics.The thermal conductivity of diamonds at the normal atmospherictemperature is five times more than copper. Moreover, the thermalexpansion factor of diamonds at high temperature is very small thatshows the excellent efficiency for heat dissipating. The feature mayhelp people to differentiate the adulteration of diamonds. In the priorart, many technologies and manufacture procedures have been developed tomake diamonds. The direct decomposition for hydrocarbons is the mostfamiliar method like Microwave Plasma Enhance Chemical Vapor Deposition(MPCVD) and Hot Filament CVD (HFCVD). By the aforesaid methods,polycrystalline diamond films can be deposited. The characteristic ofthe polycrystalline diamond films is same as the single crystaldiamonds.

SUMMARY OF THE INVENTION

Briefly, to eliminate the waste heat generated by electronic componentsefficiently and to face the development tendency of electroniccomponents with small volumes and high densities, the object of thepresent invention is to provide a heat conduction material which isapplied for a dissipation heat pipe to improve the efficiency of heatdissipation for a chip. The waste heat caused by the high temperature,which is generated from the operation of the chip, can be reduced. Inaddition, the heat conduction material provided by the present inventionis not only restricted for the heat dissipation of the chip, but is alsoapplied for other heat conduction apparatuses.

The heat conduction material provided by the present invention isapplied for a dissipation heat pipe and the heat conduction materialcomprises combining a metal with a bracket structure of carbon element.The metal can be copper or aluminum or other metals with high thermalconductivity. The bracket structure of carbon element is diamonds andcan also be used for coating on the metal surface or for encapsulatingin materials. The bracket structure of carbon element can be furtherused in combining the metal with the materials.

The heat conduction material can be made by chemical vapor deposition,physical vapor deposition, melting, electroplating or othermanufacturing methods. Other features and advantages of the presentinvention and variations thereof will become apparent from the followingdescription, drawings, and claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is schematic diagram illustrating a conventional heat dissipationmodule;

FIG. 2 is a schematic diagram illustrating a die for manufacturing adissipation heat pipe which has an end without sealing according to anembodiment of the present invention;

FIG. 3 is a schematic diagram illustrating setting a wick structure intothe dissipation heat pipe according to an embodiment of the presentinvention;

FIG. 4 is a schematic diagram illustrating setting a wick structure intothe dissipation heat pipe according to another embodiment of the presentinvention;

FIG. 5 is a perspective drawing illustrating the dissipation heat pipeaccording to an embodiment of the present invention;

FIG. 6 is a schematic diagram illustrating microwave plasma enhancedchemical vapor deposition for manufacturing a heat dissipation structureaccording to an embodiment of the present invention; and

FIG. 7 is a schematic diagram illustrating ion beam sputtering formanufacturing a heat dissipation structure according to anotherembodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Referring to FIG. 2, a schematic diagram illustrates a die formanufacturing a dissipation heat pipe which has an end without sealingaccording to an embodiment of the present invention. The die comprises amold material supplier 21, a mold material injector 22 and a mold 23. Amold material is injected by the mold material injector 22 to a cavity24 of the mold 23 for molding. The shape is a hollow closed pipe whichhas an end without sealing. The mold material can be a metal material ora melt material which combines a metal with a bracket structure ofcarbon element. The metal is copper or aluminum or silver or othermetals with high thermal conductivity or other material combinations.The melting point of the bracket structure of carbon element is higherthan any metal of the mentioned above. Therefore, the bracket structureof carbon element can be mixed with those metals to form a moldmaterial.

The hollow closed pipe of a dissipation heat pipe 31 has an end withoutsealing according to FIG. 2. A wick structure 314 is formed around aninterior wall 313 of the hollow closed pipe as shown in FIG. 3. The wickstructure 314 which possesses groove shapes is etched by microstructuremanufacturing from the interior wall 313. As shown in FIG. 4, the wickstructure 314 of the interior wall 313 can also be made by sintering viaa metal mesh around the interior wall 313.

Lastly, referring to FIG. 5, a perspective drawing illustrates thedissipation heat pipe 31 which has the end with sealing after filling atype of fluid 14 according to FIG. 3 or FIG. 4. The heat conductionprocess for the dissipation heat pipe 31 is that a heat source end 311of the dissipation heat pipe 31 is connected to the upper surface 112 ofthe heat dissipation slip 11 as shown in FIG. 1. The waste heat which isdistributed on the upper surface 112 is conducted to the liquid fluid 14within the hollow closed pipe from the heat source end 311. The wasteheat is then absorbed by the liquid fluid 14 to implement a phase changefor vaporizing the liquid fluid 14 to be the gaseous fluid 14. The wasteheat carried by the gaseous fluid 14 is conducted onto the bottom 131 ofthe plurality of heat sink fins 13 as shown in FIG. 1 through the heatdissipation end 312 when the gaseous fluid 14 is diffused to a heatdissipation end 312 of the dissipation heat pipe 31 and is thencontacted to the interior wall 313 of the heat dissipation end 312. Thegaseous fluid 14 is implemented via the phase change again and is thencondensed to the liquid fluid 14. The liquid fluid 14 further returns tothe heat source end 311 through the forcing of the wick structure 314 ofthe interior wall 313. The aforesaid circulation process may help todischarge much heat. The heat is absorbed or released by the dissipationheat pipe 31 via the vaporization and the condensation of the type ofliquid. Therefore, the dissipation heat pipe 31 possesses theoutstanding heat conduction efficiency. The type of fluid 14 within thedissipation heat pipe 31 can be composed of water or liquids having heatconduction capacity.

In addition, the heat conduction material having the bracket structureof carbon element can be formed on a metal surface by using CVD or PVD.Referring to FIG. 6, a schematic diagram illustrates microwave plasmaenhanced chemical vapor deposition for manufacturing a heat dissipationstructure according to an embodiment of the present invention. In theembodiment, the reaction procedure is that a mixed gas for desiredreaction is delivered to a gas reaction room 66 from a gas entrance 61.At the same time, a microwave is generated by a microwave generationsystem 62 to activate the mixed gas in order to provide reactive ionsfor reacting. A surface of a metal material 65 on a carrier 64 isabsorbed to form diamond films. The metal material 65 is the dissipationheat pipe 31 as shown in FIG. 5 and can be copper or aluminum or othermetals with high heat conductivity or other material combinations.Remaining gas is discharged via a waste gas exit 63. By the waymentioned above, a heat conduction material coating diamond particlescan be acquired.

Referring to FIG. 7, a schematic diagram illustrates ion beam sputteringfor manufacturing a heat dissipation structure according to anotherembodiment of the present invention. In the embodiment, themanufacturing procedure is that a target 72 is molded by diamondmaterials first of all. The placement angle of the target 72 and theshooting direction of ion beam of a first ion gun 71 are approximatelyforty five degrees. The diamond particles fired by the first ion gun 71fly to the front of a second ion gun 73. The diamond particles is thensputtered to the surface of a metal material 74 to form uniform diamondfilms by providing enough kinetic energy from the first ion gun 71. Themetal material 74 is the dissipation heat pipe 31 as shown in FIG. 5 andcan be copper or aluminum or other metals with high heat conductivity orother material combinations. The remaining diamond particles aredischarged by a waste gas exit 75. By the way mentioned above, a heatconduction material coating diamond particles can be acquired.

Moreover, the heat conduction material having a metal and a bracketstructure of carbon element can be further made by electroplating,melting except CVD and PVD of the above embodiments.

Although the features and advantages of the embodiments according to thepreferred invention are disclosed, it is not limited to the embodimentsdescribed above, but encompasses any and all modifications and changeswithin the spirit and scope of the following claims.

1. A dissipation heat pipe structure, applied in conducting anddissipating a heat source generated by a chip, comprising: a hollowclosed pipe having a heat source end for contacting said heat source anda heat dissipation end which being corresponded to said heat source endfor contacting a heat dissipation device, a temperature of said heatdissipation device being lower than said heat source; a type of fluid,set at said heat source end within said hollow closed pipe, after saidheat source being contacted to said heat source end to vaporize saidtype of fluid to be a vapor, said vapor being then contacted to saidheat dissipation end to form said type of fluid; and a wick structure,set at an interior wall of said hollow closed pipe for conducting saidtype of fluid to said heat source end from said heat dissipation end;wherein said hollow closed pipe is combined a metal with a bracketstructure of carbon element to form a heat conduction material.
 2. Thedissipation heat pipe structure of claim 1, wherein said heat sourcegenerated by said chip can be conducted by a heat dissipation slip tosaid heat source end.
 3. The dissipation heat pipe structure of claim 1,wherein said hollow closed pipe can be any long column.
 4. Thedissipation heat pipe structure of claim 1, wherein said hollow closedpipe can be any flat column.
 5. The dissipation heat pipe structure ofclaim 1, wherein said heat dissipation device is composed of a pluralityof heat sink fins.
 6. The dissipation heat pipe structure of claim 1,wherein said metal is copper.
 7. The dissipation heat pipe structure ofclaim 1, wherein said metal is aluminum.
 8. The dissipation heat pipestructure of claim 1, wherein said metal is silver.
 9. The dissipationheat pipe structure of claim 1, wherein said metal is a metal materialwith high thermal conductivity.
 10. The dissipation heat pipe structureof claim 1, wherein said bracket structure of carbon element is adiamond.
 11. The dissipation heat pipe structure of claim 1, whereinsaid heat conduction material can be formed by chemical vapor deposition(CVD).
 12. The dissipation heat pipe structure of claim 1, wherein saidheat conduction material can be formed by physical vapor deposition(PVD).
 13. The dissipation heat pipe structure of claim 1, wherein saidheat conduction material can be formed by melting.
 14. The dissipationheat pipe structure of claim 1, wherein said heat conduction materialcan be formed by electroplating.
 15. A method for manufacturing adissipation heat pipe structure, applied in conducting and dissipating aheat source generated by a chip, comprising: employing a manufacturingto form a heat conduction material having a metal and a bracketstructure of carbon element; employing a die to form a hollow closedpipe; forming a wick structure in an interior wall of said hollow closedpipe; forming a type of fluid, set at an end within said hollow closedpipe; and sealing said hollow closed pipe.
 16. The method formanufacturing a dissipation heat pipe structure of claim 15, furthercomprising providing copper to be said metal.
 17. The method formanufacturing a dissipation heat pipe structure of claim 15, furthercomprising providing aluminum to be said metal.
 18. The method formanufacturing a dissipation heat pipe structure of claim 15, furthercomprising providing silver to be said metal.
 19. The method formanufacturing a dissipation heat pipe structure of claim 15, furthercomprising providing a metal material having high thermal conductivityto be said metal.
 20. The method for manufacturing a dissipation heatpipe structure of claim 15, further comprising providing diamonds to besaid bracket structure of carbon element.
 21. The method formanufacturing a dissipation heat pipe structure of claim 15, furthercomprising providing CVD to form said heat conduction material.
 22. Themethod for manufacturing a dissipation heat pipe structure of claim 15,further comprising providing PVD to form said heat conduction material.23. The method for manufacturing a dissipation heat pipe structure ofclaim 15, further comprising providing melting to form said heatconduction material.
 24. The method for manufacturing a dissipation heatpipe structure of claim 15, further comprising providing electroplatingto form said heat conduction material.